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Copper (Cu-ETP)

Laser cutting, CNC machining and forming of Cu-ETP and Cu-OF busbars, contacts and heat sinks

Copper (Cu-ETP)

Copper is specified when electrical or thermal conductivity matters more than strength or cost. Cu-ETP (electrolytic tough pitch, CW004A, C11000) is the standard grade at 100% IACS conductivity and 385 W/m·K thermal conductivity; it is used for busbars, switchgear contacts, earthing plates, transformer connections and heat sinks. Suppliers in the CutLinq network laser cut copper sheet up to 8 mm, mill and turn bar up to 150 mm, and bend busbar up to 12 mm thick, with laser tolerance ±0.15 mm and machining tolerance ±0.05 mm.

Copper is about 3 to 4 times the price of mild steel per kilogram and behaves differently in every process: it reflects laser light, gums cutting tools and work hardens when bent. This page sets out the grades, the process limits and the design rules.

Copper grades and what they are used for

Cu-ETP contains 0.02-0.04% oxygen, which does not affect conductivity but causes hydrogen embrittlement if the copper is brazed or welded in a reducing atmosphere. Cu-OF (oxygen-free, CW008A, C10200) avoids that and is chosen for vacuum and welded assemblies. Cu-DHP (CW024A) is phosphorus-deoxidised plumbing copper with only 85% IACS and should not be used for busbars. Copper alloys such as CuZn37 brass and CuCrZr are covered on their own pages; CuCrZr is the choice for welding electrodes and high-temperature contacts because it keeps 80% IACS with three times the strength.

Copper grades and what they are used for
Grade (EN / UNS)ConductivityTensile strengthTypical formUse
Cu-ETP CW004A (C11000)100% IACS200-350 MPa (R240-R300)Sheet, busbar, rodBusbars, contacts, earthing
Cu-OF CW008A (C10200)101% IACS200-350 MPaSheet, rodWelded or brazed assemblies, vacuum
Cu-DHP CW024A (C12200)85% IACS220-350 MPaTube, sheetPlumbing, roofing, not electrical
CuCrZr CW106C (C18150)80% IACS400-550 MPaRod, plateWelding electrodes, moulds
CuZn37 CW508L (C27200)27% IACS300-450 MPaSheet, rodDecorative, fittings

Laser cutting copper: limits and edge quality

Copper reflects around 95% of 1 µm fibre laser light at room temperature, which is why CO2 lasers could not cut it and older fibre lasers limited it to 3 mm. Fibre lasers of 4 kW and above with back-reflection protection cut Cu-ETP cleanly to 6 mm and with oxygen assist to 8 mm. Nitrogen assist gives a bright, oxide-free edge suitable for electrical contact; oxygen assist is faster but leaves a thin dark oxide that must be cleaned before plating. Kerf is 0.2-0.3 mm and the minimum hole diameter is 1 × thickness.

For thicker busbar (10-20 mm) waterjet cutting is used; it produces no heat-affected zone and holds ±0.2 mm. Punching is efficient for repetitive busbar hole patterns in 5-10 mm bar and leaves a slight roll-over on one side that is acceptable for bolted joints.

Laser cutting copper: limits and edge quality
ProcessThickness rangeToleranceEdge conditionNote
Fibre laser, nitrogen0.5 - 6 mm±0.15 mmBright, contact-readyBest for contacts and thin busbar
Fibre laser, oxygen3 - 8 mm±0.2 mmLight oxideClean before tin or silver plating
Waterjet3 - 50 mm±0.2 mmMatt, no HAZThick busbar, no heat
CNC punching2 - 10 mm±0.1 mmSlight roll-overRepetitive hole patterns
CNC millingAny±0.05 mmRa 0.8 - 1.6 µmContacts, water-cooled blocks

Machining and bending behaviour

Pure copper is gummy: it forms a built-up edge on the tool and produces long stringy chips that wrap around the workpiece. Suppliers use sharp polished carbide inserts with high rake angles, flood coolant and high spindle speeds (300-500 m/min surface speed). Tapping needs a 65-70% thread height rather than the usual 75% or the tap will seize. Milled copper heat sink bases reach Ra 0.8 µm; lapping to Ra 0.2 µm is possible for thermal interface surfaces.

Bending is done in the soft (R220/R240) temper. Half-hard R290 busbar bends to a minimum inside radius of 1 × thickness across the grain and 2 × thickness along the grain; below that the outside surface cracks. Edgewise bends (bending a 10 × 100 mm busbar in the 100 mm direction) require a dedicated busbar bender and are limited to radii of 2 × width.

Surface finishing for MENA conditions

Bare copper tarnishes within weeks in the humid coastal air of Alexandria, Jeddah and the UAE, and the oxide layer raises contact resistance. Busbars for switchgear are therefore tin plated (5-15 µm) or silver plated (3-10 µm) at bolted joints. Tin is standard for indoor panels; silver is used above 90 °C operating temperature or where contact resistance must stay below 10 µΩ. Full-length epoxy or heat-shrink insulation is applied after plating. For decorative copper cladding in Riyadh or Dubai, a clear lacquer slows the change to brown but does not stop it; a chemical patina applied at the factory gives a stable dark finish.

  • Tin plating 5-15 µm: standard for busbar joints and earthing
  • Silver plating 3-10 µm: high current density or above 90 °C
  • Nickel plating 5-10 µm: barrier under gold for electronics
  • Clear lacquer 20-30 µm: decorative parts, slows tarnish
  • No coating: parts that will be soldered or brazed within days

Sizing a busbar: worked example

A 400 A feeder in a panel at 40 °C ambient, typical for a Riyadh substation room, needs about 1.5-1.8 A/mm² for a single bare copper bar in free air. That gives 400 / 1.6 = 250 mm², so a 5 × 50 mm bar (250 mm²) is the starting point; standard practice in the region is to step up to 6 × 50 or 5 × 60 mm to cover enclosure derating. Bolted joints should overlap by at least the bar width and use M10 bolts with Belleville washers to hold contact pressure as the copper creeps. Send the busbar drawing as DXF with hole positions and bend lines; suppliers cut, punch, bend and tin plate as one order.

Design tips

  • Specify Cu-ETP CW004A R240 (soft) for bent busbar and R290 (half-hard) for flat contacts that must stay rigid
  • Keep laser-cut copper at 6 mm or below with nitrogen assist; move to waterjet or punching above 8 mm
  • Inside bend radius: 1 × thickness across the grain, 2 × thickness along it; note grain direction on the DXF
  • Busbar hole clearance: 11 mm for M10, 13.5 mm for M12, spaced at least 2 × hole diameter from the edge
  • Call out plating and thickness on the drawing, for example 'tin plate 8-12 µm, all over, mask threads'
  • Use Cu-OF instead of Cu-ETP for any part that will be TIG brazed or hydrogen-furnace treated
  • For machined heat sinks, hold fin thickness at 1 mm minimum and fin height under 10 × thickness to avoid chatter

Applications

Applications
IndustryExample partsTypical material
Switchgear and panelsBusbars, links, neutral barsCu-ETP 5-12 mm, tin plated
Solar and battery storageInverter connection bars, cell busbarsCu-ETP 2-6 mm laser cut
Earthing and lightningEarth plates, tape clampsCu-ETP 3 mm, bare or tinned
Electronics coolingHeat sink bases, vapour chamber lidsCu-OF machined, Ra 0.8 µm
Welding equipmentElectrode holders, shuntsCuCrZr, Cu-ETP
Architecture and signageCladding panels, lettersCu-DHP 1-2 mm, patinated
TransformersWinding leads, terminal platesCu-ETP 4-10 mm, silver plated

Pricing and lead time

Copper part cost is dominated by material, which is typically 60-75% of the price and moves with the LME copper rate; the second factor is cutting method, since laser cutting copper is 40-60% slower than the same thickness in steel and waterjet slower still; the third is plating, which adds a separate process and a transport leg. Quantity helps less than with steel because material dominates. Laser-cut copper parts ship in 3 to 6 working days, machined copper parts in 6 to 10 working days, and plated busbars in 8 to 14 working days depending on the plating shop schedule.

Frequently asked questions

10 mm is beyond clean fibre laser cutting for copper. Suppliers cut it by waterjet with ±0.2 mm tolerance or punch it if the pattern is simple bolt holes. Send the DXF and both options are quoted.

Upload your DXF or STEP file for copper parts and receive a binding quote within 12 hours.